Advanced IC Substrates Market Overview
The Advanced IC Substrates Market is becoming a central pillar of the global semiconductor packaging ecosystem as chip designs grow more complex and performance-driven. According to Mordor Intelligence, the Advanced IC Substrates Market size was valued at USD 10.66 billion in 2025, expanded to USD 11.4 billion in 2026, and is projected to reach USD 15.96 billion by 2031, reflecting steady momentum across advanced computing, mobile electronics, and automotive applications.
The Advanced IC Substrates industry is also shaped by strong geographic concentration in Asia-Pacific, where manufacturers benefit from established ABF capacity, proximity to foundries, and long-term supply agreements with packaging partners.
Key Advanced IC Substrates Market Trends
Surging Demand for ABF-Based Substrates
AI accelerators and data-center processors are driving demand for ABF-based substrates. These substrates support higher I/O density, tighter routing, and improved thermal performance for intensive AI workloads.
Rise of Heterogeneous Integration and Chiplet
Advanced packaging approaches like interposers, stacked dies, and system-in-package designs rely on high-performance substrates. They ensure signal integrity and reliability across dense and complex layouts, highlighting ongoing Advanced IC Substrates Market growth.
Growing Interest in Glass-Core Substrates
Glass-core substrates offer dimensional stability and flatness, enabling finer features and better warpage control. They are emerging as a strong alternative to organic materials in ultra-high-density packages, influencing the Advanced IC Substrates Market share among key material types.
Expanding Opportunities from Automotive Electrification
The shift to electric vehicles is influencing substrate requirements, creating demand for ceramic and specialty solutions. This trend broadens the market beyond computing into automotive electronics, shaping the overall Advanced IC Substrates Market forecast.
Check out more details and stay updated with the latest industry trends, including the Japanese version for localized insights: https://www.mordorintelligence.com/ja/industry-reports/advanced-ic-substrates-market?utm_source=abnewswire
Advanced IC Substrates Market Segmentation Insights
By Substrate Type
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FC-BGA
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FC-CSP
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Organic BGA/LGA
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Rigid-Flex and Flex CSP
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Others
By Core Material
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ABF
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BT
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Glass
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LTCC / HTCC
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Ceramic
By Packaging Technology
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2D Flip-Chip
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2.5D Interposer
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3D-IC / SoIC
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Fan-Out WLP
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SiP / Module
By Device Node
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≥28 nm
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16/14–10 nm
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7–5 nm
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4 nm and below
By End-Use Industry
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Mobile and Consumer
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Automotive and Transportation
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IT and Telecom Infrastructure
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Data-centre / AI and HPC
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Industrial, Medical and Others
By Geography
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North America
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South America
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Europe
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Asia-Pacific
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Middle East and Africa
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Key Players in the Advanced IC Substrates Market
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ASE Kaohsiung (ASE Inc.)
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AT&S Austria Technologies & Systemtechnik AG
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Siliconware Precision Industries Co. Ltd
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TTM Technologies Inc.
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Ibiden Co. Ltd
Conclusion
The Advanced IC Substrates Market is positioned for sustained expansion as semiconductor packaging becomes a strategic differentiator rather than a back-end consideration. As advanced packaging moves to the forefront of semiconductor performance, the Advanced IC Substrates Market growth trajectory reflects its essential role in enabling next-generation electronics.
With strong demand fundamentals across computing, mobility, and transportation, the Advanced IC Substrates Market forecast underscores a stable and expanding opportunity landscape for suppliers aligned with high-density, high-reliability packaging needs.
For more insights on Advanced IC Substrates Market, please visit the Mordor Intelligence Page: https://www.mordorintelligence.com/industry-reports/advanced-ic-substrates-market?utm_source=abnewswire
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